Benjang Mongkollertsirisuk. 1995. Development of thermal conductivity of metal-filled epoxy adhesives for microelectronic industry. Bangkok:Chulalongkorn University;
Benjang Mongkollertsirisuk. (1995) Development of thermal conductivity of metal-filled epoxy adhesives for microelectronic industry (รายงานผลงานวิจัย). Chulalongkorn University:Bangkok.
Benjang Mongkollertsirisuk. Development of thermal conductivity of metal-filled epoxy adhesives for microelectronic industry. Bangkok:Chulalongkorn University, 1995.
Benjang Mongkollertsirisuk. (1995) Development of thermal conductivity of metal-filled epoxy adhesives for microelectronic industry (รายงานผลงานวิจัย). Chulalongkorn University:Bangkok.