Attribution
Non-Commercial
No Derivative Works
Nisit Tantavichet. 2009. The study of influence of copper and its interaction with other additive on copper electrodeposition in sulphate plating solution. Bangkok:Chulalongkorn University;
Nisit Tantavichet. (2009) The study of influence of copper and its interaction with other additive on copper electrodeposition in sulphate plating solution (รายงานผลงานวิจัย). Chulalongkorn University:Bangkok.
Nisit Tantavichet. The study of influence of copper and its interaction with other additive on copper electrodeposition in sulphate plating solution. Bangkok:Chulalongkorn University, 2009.
Nisit Tantavichet. (2009) The study of influence of copper and its interaction with other additive on copper electrodeposition in sulphate plating solution (รายงานผลงานวิจัย). Chulalongkorn University:Bangkok.
